Adhésif pour micro-haut-parleurs

With the development of electronic products, speakers are developing in the direction of small cavity, ultra-thin, high sound quality, and high power. Volume reduction means a decrease in bonding area, which requires higher strength and faster curing speed of the adhesive; An increase in power means more heat dissipation, which requires better temperature resistance of the adhesive; And more new substrates are being introduced, which also requires better adaptability of adhesives to different materials. In addition, waterproofing, drop resistance, and how to make adhesives more suitable for automated production to reduce production costs should also be considered. HanSi Electronics has a complete solution for speakers, targeting applications such as magnetic steel bonding (edge/center magnetic), center glue, DOME glue, diaphragm and bracket/front cover, Yoke glue, lead fixation, Box monomer fixation/monomer sealing, etc. HanSi Electronics provides low-temperature epoxy, UV glue, UV double fixation PUR、 Comprehensive and customized speaker module bonding and sealing solutions, including acrylic acid, modified silane adhesive, and other technical categories.

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